Patent Assignment
Reel/Frame 055074/0321
Assignment of Assignor's Interest
Recorded: 2021-01-29
Pages: 4
Assignors
HSU, CHUNG-WEI
Executed: 2020-12-14
CHIANG, KUO-CHENG
Executed: 2020-12-14
HUANG, MAO-LIN
Executed: 2020-12-14
CHU, LUNG-KUN
Executed: 2020-12-14
YU, JIA-NI
Executed: 2020-12-14
CHENG, KUAN-LUN
Executed: 2020-12-14
WANG, CHIH-HAO
Executed: 2020-12-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Fabrication Methods and Structures Thereof