Patent Assignment
Reel/Frame 055077/0513
Assignment of Assignor's Interest
Recorded: 2021-01-29
Pages: 10
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 1076325, JAPAN
Covered Property
(1)
Method for Processing Substrate, Processing Apparatus, and Processing System