Patent Assignment
Reel/Frame 055079/0225
Assignment of Assignor's Interest
Recorded: 2021-01-29
Pages: 3
Assignors
WU, GUO-HUEI
Executed: 2020-11-19
CHEN, SHUN-LI
Executed: 2020-11-19
ZHUANG, HUI-ZHONG
Executed: 2020-12-08
CHEN, CHIH-LIANG
Executed: 2020-12-08
TIEN, LI-CHUN
Executed: 2020-11-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Interconnect Structure in Semiconductor Device and Method of Forming the Same