Patent Assignment
Reel/Frame 055089/0774
Assignment of Assignor's Interest
Recorded: 2021-02-01
Pages: 4
Assignors
JIANG, YU-WEI
Executed: 2020-12-03
LAI, SHENG-CHIH
Executed: 2020-12-03
YANG, TSUCHING
Executed: 2020-12-03
SUN, HUNG-CHANG
Executed: 2020-12-03
CHIANG, KUO-CHANG
Executed: 2020-12-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Memory Device Comprising Conductive Pillars and Method of Forming the Same