Patent Assignment
Reel/Frame 055089/0845
Assignment of Assignor's Interest
Recorded: 2021-02-01
Pages: 4
Assignors
HOU, HAO-CHENG
Executed: 2021-01-13
CHEN, WEI-YU
Executed: 2021-01-15
CHENG, JUNG-WEI
Executed: 2021-01-24
WANG, TSUNG-DING
Executed: 2021-01-13
LEE, CHIEN-HSUN
Executed: 2021-01-14
LIU, CHUNG-SHI
Executed: 2021-01-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package Having Molded Die and Semiconductor Die and Manufacturing Method Thereof