Patent Assignment
Reel/Frame 055095/0452
Assignment of Assignor's Interest
Recorded: 2021-02-01
Pages: 7
Assignors
YANG, DEOKKYUNG
Executed: 2018-11-15
LEE, HUNTEAK
Executed: 2018-11-15
LEE, HEESOO
Executed: 2018-11-15
LEE, WANIL
Executed: 2018-11-15
LEE, SANGDUK
Executed: 2018-11-14
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Molded Laser Package with Electromagnetic Interference Shield and Method of Making
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.