Patent Assignment
Reel/Frame 055108/0527
Assignment of Assignor's Interest
Recorded: 2021-02-02
Pages: 3
Assignors
TSENG, HSINHSIANG
Executed: 2020-10-23
YEH, CHI-RUEI
Executed: 2020-10-23
CHIANG, TSUNG-YU
Executed: 2020-10-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD., 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Barrier Layer for Contact Structures of Semiconductor Devices