Patent Assignment
Reel/Frame 055119/0351
Assignment of Assignor's Interest
Recorded: 2021-02-02
Pages: 3
Assignor
YANG, CHENG-JER
Executed: 2021-01-29
Assignee
CHANGXIN MEMORY TECHNOLOGIES, INC.
NO. 388, XINGYE AVENUE, ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA, HEFEI, ANHUI, CHINA
Covered Property
(1)
Through-Silicon via (Tsv) Fault-Tolerant Circuit, Method for Tsv Fault-Tolerance and Integrated Circuit (Ic)