Patent Assignment
Reel/Frame 055156/0266
Assignment of Assignor's Interest
Recorded: 2021-02-04
Pages: 4
Assignors
SAEKI, HIDEFUMI
Executed: 2020-11-19
KARASAKI, HIDEHIKO
Executed: 2020-11-19
OKITA, SHOGO
Executed: 2020-11-05
HARIKAI, ATSUSHI
Executed: 2020-11-19
ITOU, AKIHIRO
Executed: 2020-11-19
Assignee
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
1-61, SHIROMI 2-CHOME, CHUO-KU, OSAKA-SHI, OSAKA, 540-6207, JAPAN
Covered Property
(1)
Element Chip Isolation Method Using Laser Grooving and Plasma Etching