Patent Assignment
Reel/Frame 055159/0518
Assignment of Assignor's Interest
Recorded: 2021-02-05
Pages: 4
Assignors
HUANG, RAINER YEN-CHIEH
Executed: 2021-02-02
CHEN, HAI-CHING
Executed: 2021-02-02
LIN, CHUNG-TE
Executed: 2021-02-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Capping Layer Over Fet Feram to Increase Charge Mobility