Patent Assignment
Reel/Frame 055164/0098
Assignment of Assignor's Interest
Recorded: 2021-02-05
Pages: 3
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages and Methods of Forming the Semiconductor Packages