Patent Assignment
Reel/Frame 055166/0723
Assignment of Assignor's Interest
Recorded: 2021-02-05
Pages: 4
Assignors
WU, GUO-HUEI
Executed: 2021-01-31
ZHUANG, HUI-ZHONG
Executed: 2021-01-31
CHEN, CHIH-LIANG
Executed: 2021-01-31
CHUANG, CHENG-CHI
Executed: 2021-01-31
CHANG, SHANG-WEN
Executed: 2021-01-31
CHIU, YI-HSUN
Executed: 2021-01-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Device Including Recessed Interconnect Structure