Patent Assignment
Reel/Frame 055179/0305
Assignment of Assignor's Interest
Recorded: 2021-02-08
Pages: 7
Assignors
YEDURU, SRINIVASA REDDY
Executed: 2021-01-24
CHANG, GEORGE
Executed: 2021-01-27
GRIVNA, GORDON M.
Executed: 2021-02-08
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Structure and Method for Electronic Die Singulation Using Alignment Structures and Multi-Step Singulation
Application:
17/248,514 →
Publication:
US 2021/0296176
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 15, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 056595/0177 →
Release of Security Interest in Patents Previously Recorded at Reel 056595, Frame 0177
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0564 →