Patent Assignment
Reel/Frame 055196/0277
Assignment of Assignor's Interest
Recorded: 2021-02-09
Pages: 4
Assignors
HSIUNG, TE-CHIH
Executed: 2021-01-18
CHANG, YI-CHUN
Executed: 2021-02-02
WANG, YI-CHEN
Executed: 2021-01-31
TU, YUAN-TIEN
Executed: 2021-01-24
LIN, HUAN-JUST
Executed: 2021-01-18
WU, JYUN-DE
Executed: 2021-02-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Etch Profile Control of via Opening