Patent Assignment
Reel/Frame 055197/0302
Assignment of Assignor's Interest
Recorded: 2021-02-09
Pages: 8
Assignors
CHANG, FU-CHEN
Executed: 2019-06-10
TU, KUO-CHI
Executed: 2019-06-10
CHU, WEN-TING
Executed: 2019-06-10
HUANG, CHU-JIE
Executed: 2019-06-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method for Forming Rram with a Barrier Layer