Patent Assignment
Reel/Frame 055208/0285
Assignment of Assignor's Interest
Recorded: 2021-02-10
Pages: 7
Assignors
WOO, CHANG-SU
Executed: 2020-12-14
KIM, HAERYONG
Executed: 2020-12-14
KIM, YOUNSOO
Executed: 2020-12-14
MOON, SUNMIN
Executed: 2020-12-14
SONG, JEONGGYU
Executed: 2020-12-14
JUNG, KYOOHO
Executed: 2020-12-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device with Capping Conductive Layer on an Electrode and Method of Fabricating the Same