Patent Assignment
Reel/Frame 055208/0685
Assignment of Assignor's Interest
Recorded: 2021-02-03
Pages: 4
Assignors
CHANG, CHE-LUN
Executed: 2020-12-15
LEE, WEI-YANG
Executed: 2020-12-30
LIN, CHIA-PIN
Executed: 2020-12-15
PENG, YUAN-CHING
Executed: 2020-12-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Structure with Backside Dielectric Layer Having Air Gap