Patent Assignment
Reel/Frame 055219/0735
Assignment of Assignor's Interest
Recorded: 2021-02-10
Pages: 8
Assignors
LEI, WEI-SHENG
Executed: 2021-02-03
EATON, BRAD
Executed: 2021-02-10
KUMAR, AJAY
Executed: 2021-02-03
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Wafer Dicing Using Hybrid Laser Scribing and Plasma Etch Approach with Intermediate Breakthrough Treatment