Patent Assignment
Reel/Frame 055230/0900
Assignment of Assignor's Interest
Recorded: 2021-02-05
Pages: 52
Assignors
SUNEDISON SEMICONDUCTOR LIMITED
Executed: 2018-06-06
MEMC JAPAN LTD
Executed: 2018-06-06
MEMC ELECTRONIC MATERIALS S.P.A
Executed: 2018-06-06
Assignee
GLOBALWAFERS CO., LTD.
NO. 8. INDUSTRIAL EAST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Methods for Forming Single Crystal Silicon Ingots with Improved Resistivity Control
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 5, 2021
From: PHILLIPS, RICHARD J.; DAGGOLU, PARTHIV; GITLIN, ERIC MICHAEL; STANDLEY, ROBERT W.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 055167/0128 →
Employment Agreement
Feb 5, 2021
From: BASAK, SOUBIR
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 055229/0331 →
Separation Agreement
Feb 5, 2021
From: SUNEDISON, INC.
To: SUNEDISON SEMICONDUCTOR LIMITED
Reel/Frame 055230/0727 →
Change of Name
Feb 5, 2021
From: MEMC ELECTRONIC MATERIALS, INC.
To: SUNEDISON, INC.
Reel/Frame 055251/0307 →