Patent Assignment
Reel/Frame 055236/0309
Assignment of Assignor's Interest
Recorded: 2021-02-11
Pages: 4
Assignor
FUJI, KAZUNORI
Executed: 2021-01-06
Assignee
ROHM CO., LTD.
21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO-SHI, KYOTO, 615-8585, JAPAN
Covered Property
(1)
Package Structure, Semiconductor Device, and Formation Method for Package Structure