Patent Assignment
Reel/Frame 055237/0345
Assignment of Assignor's Interest
Recorded: 2021-02-11
Pages: 9
Assignors
YAMAKAWA, JUNITSU
Executed: 2020-10-29
DOU, CHUNHUI
Executed: 2021-02-11
KIMURA, RISA
Executed: 2020-10-22
YOKOYAMA, TOSHIO
Executed: 2020-10-21
Assignee
EBARA CORPORATION
11-1, HANEDA ASAHI-CHO, OTA-KU, TOKYO, 1448510, JAPAN
Covered Property
(1)
Copper Oxide Solid for Use in Plating of a Substrate, Method of Producing the Copper Oxide Solid, and Apparatus for Supplying a Plating Solution into a Plating Tank