Patent Assignment
Reel/Frame 055249/0483
Assignment of Assignor's Interest
Recorded: 2021-02-12
Pages: 3
Assignor
HSU, CHIA-CHI
Executed: 2021-01-29
Assignee
CHANGXIN MEMORY TECHNOLOGIES, INC.
NO. 388, XINGYE AVENUE, ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA, HEFEI, ANHUI, CHINA
Covered Property
(1)
Arrangement of Bond Pads on an Integrated Circuit Chip