Patent Assignment
Reel/Frame 055259/0174
Assignment of Assignor's Interest
Recorded: 2021-02-15
Pages: 5
Assignors
LEE, KAI-HSUAN
Executed: 2018-11-12
LAI, BO-YU
Executed: 2018-09-28
YEONG, SAI-HOOI
Executed: 2018-09-28
YANG, FENG-CHENG
Executed: 2018-09-28
LIN, YIH-ANN
Executed: 2018-11-12
CHEN, YEN-MING
Executed: 2018-11-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Self-Aligned Contact Air Gap Formation