Patent Assignment
Reel/Frame 055260/0410
Assignment of Assignor's Interest
Recorded: 2021-02-15
Pages: 3
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including a Wire and a Method of Fabricating the Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.