IP Library Assignment 055268/0056
Patent Assignment
Reel/Frame 055268/0056

Change of Name

Recorded: 2021-02-10 Pages: 53
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Polyphenylene Ether Derivative Having N-Substituted Maleimide Group, and Heat Curable Resin Composition, Resin Varnish, Prepreg, Metal-Clad Laminate, and Multilayer Printed Wiring Board Using Same
Patent: 9,828,466 →
Application: 15/301,655 →
Publication: US 2017/0051109
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 28, 2016
From: MIZUNO, YASUYUKI; FUKUDA, TOMIO; TANIGAWA, TAKAO; NAGAI, YUKI
To: HITACHI CHEMICAL COMPANY, LTD
Reel/Frame 040160/0450 →
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →