Patent Assignment
Reel/Frame 055274/0592
Assignment of Assignor's Interest
Recorded: 2021-02-16
Pages: 4
Assignor
KIM, SEUNGMIN
Executed: 2021-01-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO,, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Package Substrate and Semiconductor Package Including the Same