Patent Assignment
Reel/Frame 055300/0118
Assignment of Assignor's Interest
Recorded: 2021-02-17
Pages: 5
Assignors
CHOI, JE HYUN
Executed: 2021-02-17
OH, SUNG LAE
Executed: 2021-02-17
CHAI, SOO YEOL
Executed: 2021-02-17
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, GYEONGGI-DO, ICHEON-SI, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Memory Device Having Wafer-to-Wafer Bonding Structure