Patent Assignment
Reel/Frame 055301/0986
Assignment of Assignor's Interest
Recorded: 2021-02-17
Pages: 4
Assignors
YOUNG, BO-FENG
Executed: 2021-01-08
YEONG, SAI-HOOI
Executed: 2020-12-29
LIN, YU-MING
Executed: 2020-12-29
WU, CHAO-I
Executed: 2021-01-08
MANFRINI, MAURICIO
Executed: 2020-12-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Memory Device Structure and Manufacturing Method Thereof