Patent Assignment
Reel/Frame 055302/0198
Assignment of Assignor's Interest
Recorded: 2021-02-18
Pages: 3
Assignors
YOUNG, BO-FENG
Executed: 2021-01-07
WANG, SHENG-CHEN
Executed: 2021-01-07
YEONG, SAI-HOOI
Executed: 2021-01-07
LIN, YU-MING
Executed: 2021-01-07
WU, CHAO-I
Executed: 2021-01-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Chip