Patent Assignment
Reel/Frame 055315/0181
Assignment of Assignor's Interest
Recorded: 2021-02-18
Pages: 4
Assignors
LEE, TSUNG-YEN
Executed: 2021-02-16
HSU, CHIA-KUEI
Executed: 2021-02-16
TSAI, SHANG-LUN
Executed: 2021-02-16
YEW, MING-CHIH
Executed: 2021-02-16
LIN, PO-YAO
Executed: 2021-02-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Multi-Bump Connection to Interconnect Structure and Manufacturing Method Thereof