Patent Assignment
Reel/Frame 055318/0236
Assignment of Assignor's Interest
Recorded: 2021-02-18
Pages: 4
Assignors
WU, CHAO-I
Executed: 2020-12-30
YEONG, SAI-HOOI
Executed: 2021-01-03
LIN, YU-MING
Executed: 2020-12-30
CHIA, HAN-JONG
Executed: 2020-12-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Three-Dimensional Memory Device and Manufacturing Method Thereof