Patent Assignment
Reel/Frame 055318/0288
Assignment of Assignor's Interest
Recorded: 2021-02-18
Pages: 9
Assignors
YUN, CHANGHAN HOBIE
Executed: 2021-02-10
KIM, DANIEL DAEIK
Executed: 2021-02-11
THADESAR, PARAGKUMAR AJAYBHAI
Executed: 2021-02-10
PARK, NOSUN
Executed: 2021-02-15
VADHAVKAR, SAMEER SUNIL
Executed: 2021-02-11
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
Chip Modules Employing Conductive Pillars to Couple a Passive Component Device to Conductive Traces in a Metallization Structure to Form a Passive Component