Patent Assignment
Reel/Frame 055319/0078
Assignment of Assignor's Interest
Recorded: 2021-02-18
Pages: 4
Assignors
SHIH, HUNG-LING
Executed: 2021-01-17
LIU, MING CHYI
Executed: 2021-01-17
LU, JIECH-FUN
Executed: 2021-01-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Through-Substrate via Formation to Enlarge Electrochemical Plating Window