Patent Assignment
Reel/Frame 055326/0805
Assignment of Assignor's Interest
Recorded: 2021-02-19
Pages: 3
Assignee
SHOWA DENKO PACKAGING CO., LTD.
31, SUZUKAWA, ISEHARA-SHI, KANAGAWA, 259-1146, JAPAN
Covered Property
(1)
Packaging Material for Molding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.