Patent Assignment
Reel/Frame 055327/0499
Assignment of Assignor's Interest
Recorded: 2021-02-19
Pages: 6
Assignors
BAE, DEOKHAN
Executed: 2020-12-21
KIM, SUNGMIN
Executed: 2020-12-22
PARK, JUHUN
Executed: 2020-12-22
LEE, YURI
Executed: 2020-12-22
JUNG, YOONYOUNG
Executed: 2020-12-21
HONG, SOOYEON
Executed: 2020-12-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices and Methods of Manufacturing the Same