Patent Assignment
Reel/Frame 055329/0013
Assignment of Assignor's Interest
Recorded: 2021-02-19
Pages: 2
Assignor
NISHIKAWA, JUN
Executed: 2021-02-15
Assignee
TAIYO YUDEN CO., LTD.
7-19 KYOBASHI 2-CHOME, CHUO-KU,, TOKYO, 104-0031, JAPAN
Covered Property
(1)
Multi-Layer Ceramic Electronic Component, Method of Producing a Multi-Layer Ceramic Electronic Component, and Circuit Board