Patent Assignment
Reel/Frame 055346/0773
Assignment of Assignor's Interest
Recorded: 2021-02-21
Pages: 7
Assignors
LEE, BYOUNG-HOON
Executed: 2018-03-30
NA, HOON-JOO
Executed: 2018-03-30
SUH, SUNG-IN
Executed: 2018-03-30
SONG, MIN-WOO
Executed: 2018-03-30
LEE, CHAN-HYEONG
Executed: 2018-03-30
LEE, HU-YONG
Executed: 2018-03-30
HYUN, SANG-JIN
Executed: 2018-03-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing the Same