Patent Assignment
Reel/Frame 055354/0121
Assignment of Assignor's Interest
Recorded: 2021-02-22
Pages: 4
Assignors
CLEVENGER, LAWRENCE A.
Executed: 2017-03-28
RADENS, CARL J.
Executed: 2017-03-28
ZHANG, JOHN H.
Executed: 2017-03-28
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
1 ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Forming Self-Aligned Vias and Air-Gaps in Semiconductor Fabrication
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 22, 2021
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 055354/0215 →
Change of Name
Jun 6, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 060287/0859 →
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
Change of Name
Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0410 →