Patent Assignment
Reel/Frame 055363/0988
Assignment of Assignor's Interest
Recorded: 2021-02-23
Pages: 4
Assignors
SHIM, JONGBO
Executed: 2020-12-30
KIM, JIHWANG
Executed: 2020-12-30
YIM, CHOONGBIN
Executed: 2020-12-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Interposer and Method of Manufacturing the Semiconductor Package