Patent Assignment
Reel/Frame 055364/0024
Assignment of Assignor's Interest
Recorded: 2021-02-23
Pages: 7
Assignors
KIM, JUNHYUNG
Executed: 2020-12-14
LEE, JOONGHA
Executed: 2020-12-14
PARK, SANGHA
Executed: 2020-12-14
KIM, SUNGHYUP
Executed: 2020-12-14
LIM, KYEONGBIN
Executed: 2020-12-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Chip Bonding Apparatus and Method of Manufacturing Semiconductor Device Using the Apparatus