Patent Assignment
Reel/Frame 055376/0799
Assignment of Assignor's Interest
Recorded: 2021-02-23
Pages: 4
Assignors
JUNG, HYUNG IL
Executed: 2021-02-22
YANG, HUI SUK
Executed: 2021-02-22
KIM, HYEON JUN
Executed: 2021-02-22
Assignees
INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
50, YONSEI-RO, SEODAEMUN-GU, SEOUL, 03722, KOREA, REPUBLIC OF
JUVIC INC.
#208, 272, DIGITAL-RO, GURO-GU, SEOUL, 08389, KOREA, REPUBLIC OF
Covered Property
(1)
Perforated Plate Microstructure Module