Patent Assignment
Reel/Frame 055396/0868
Assignment of Assignor's Interest
Recorded: 2021-02-24
Pages: 10
Assignors
CHIU, CHIA-PIN
Executed: 2020-12-05
WAN, ZHIMIN
Executed: 2020-12-11
LI, PENG
Executed: 2021-02-03
GOYAL, DEEPAK
Executed: 2021-02-03
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Tec-Embedded Dummy Die to Cool the Bottom Die Edge Hotspot