Patent Assignment
Reel/Frame 055397/0273
Assignment of Assignor's Interest
Recorded: 2021-02-24
Pages: 11
Assignors
WE, HONG BOK
Executed: 2021-02-02
HSU, MARCUS
Executed: 2021-02-16
PATIL, ANIKET
Executed: 2021-02-06
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Package Having a Substrate Comprising Surface Interconnects Aligned with a Surface of the Substrate