Patent Assignment
Reel/Frame 055407/0334
Assignment of Assignor's Interest
Recorded: 2021-02-25
Pages: 4
Assignors
LIN, YU-SHENG
Executed: 2021-02-19
LIN, PO-YAO
Executed: 2021-02-24
YEH, SHU-SHEN
Executed: 2021-02-19
WANG, CHIN-HUA
Executed: 2021-02-19
JENG, SHIN-PUU
Executed: 2021-02-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package Structure and Method for Forming the Same