Patent Assignment
Reel/Frame 055415/0081
Assignment of Assignor's Interest
Recorded: 2021-02-25
Pages: 4
Assignors
CHIU, TE-HSIN
Executed: 2021-02-21
LIN, WEI-CHENG
Executed: 2021-02-18
LAI, WEI-AN
Executed: 2021-02-17
TZENG, JIANN-TYNG
Executed: 2021-02-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit, System and Method of Forming the Same