IP Library Assignment 055435/0245
Patent Assignment
Reel/Frame 055435/0245

Assignment of Assignor's Interest

Recorded: 2021-02-26 Pages: 4
Assignor
NISHIMURA, TETSURO
Executed: 2021-01-30
Assignee
NIHON SUPERIOR CO., LTD.
1-16-15, ESAKACHO, SUITA-SHI, OSAKA, 5640063, JAPAN
Covered Property (1)
Lead-Free Solder Alloy and Solder Joint Part
Application: 17/272,246 →
Publication: US 2022/0016733