Patent Assignment
Reel/Frame 055476/0677
Assignment of Assignor's Interest
Recorded: 2021-03-03
Pages: 3
Assignor
TSENG, LEE-CHUAN
Executed: 2021-03-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Mapping Wafers in a Wafer Carrier