IP Library Assignment 055511/0474
Patent Assignment
Reel/Frame 055511/0474

Assignment of Assignor's Interest

Recorded: 2021-03-05 Pages: 3
Assignor
DECA TECHNOLOGIES INC.
Executed: 2020-12-22
Assignee
DECA TECHNOLOGIES USA, INC.
7855 SOUTH RIVER PARKWAY, SUITE 205, TEMPE, ARIZONA, 85284
Covered Properties (2)
Substrate Carrier for Wet Chemical Processing
Patent: 8,236,151 →
Application: 12/851,403 →
Integrated Shielding for Wafer Plating
Patent: 9,653,339 →
Application: 13/028,380 →
Publication: US 2011/0308955
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2010
From: OLSON, TIMOTHY L.; BLAISDELL, KENNETH CHARLES; KOUTNY, WILLIAM WALTER CHARLES, JR.
To: DECA TECHNOLOGIES INC.
Reel/Frame 024798/0083 →
Assignment of Assignor's Interest Sep 1, 2011
From: OLSON, TIM
To: DECA TECHNOLOGIES, INC
Reel/Frame 026847/0074 →
Assignment of Assignor's Interest Dec 27, 2021
From: DECA TECHNOLOGIES USA, INC.
To: SEMSYSCO GMBH
Reel/Frame 058479/0846 →
Change of Name Mar 11, 2026
From: SEMSYSCO GMBH
To: LAM RESEARCH SALZBURG GMBH
Reel/Frame 075091/0218 →