Substrate carrier for wet chemical processing
A carrier provides the ability to perform wet chemical processing on substrates using low cost equipment inspired by the electroplating methods typically utilized in leadframe-based semiconductor packaging or printed circuit board industries. Two frame pieces are mated together to form the carrier which enables transport of at least one substrate through wet chemical processing and includes a non-conductive frame with an exposed conductive flange to allow electrical coupling with processing equipment. Electrical contacts within the non-conductive frame make contact with the at least one substrate and are coupled to the conductive flange allowing an electrical potential to develop across the substrate while undergoing processing within the electroplating equipment.
1. A carrier for performing wet chemical processing on a substrate using processing equipment, the carrier comprising:
a conductive flange to couple the carrier to the processing equipment;
a non-conductive frame coupled to the conductive flange, the non-conductive frame to hold a first substrate in place during the wet chemical processing, wherein the non-conductive frame comprises a first frame piece coupled to a second frame piece, and wherein the first frame piece and second frame piece are substantially identical; and
a first electrical contact coupled to the conductive flange, the first electrical contact to apply an electrical potential to the first substrate.
2. The carrier of claim 1 , wherein the non-conductive frame to hold a second substrate in place during the wet chemical processing, and further comprising a second electrical contact coupled to the conductive flange, the second electrical contact to apply the electrical potential to the second substrate.
3. The carrier of claim 2 , wherein the first seal and the second seal each comprise a flexible lip to hold the first and second substrates in the first and second frame pieces while the first and second frame pieces are not secured together.
4. The carrier of claim 2 , wherein the non-conductive frame comprises a vacuum cavity to enable testing to confirm that the first frame piece, the second frame piece, the first substrate and the second substrate are properly coupled.
5. The carrier of claim 4 , wherein the first frame piece comprises a first capture ring to compress the first plurality of pogo pins into the first substrate and a second capture ring to compress the second plurality of pogo pins into the second substrate.
6. The carrier of claim 2 , further comprising:
a first plurality of pogo pins coupled to the first electrical contact and a second plurality of pogo pins coupled to the second electrical contact, the first plurality of pogo pins to contact the first substrate and the second plurality of pogo pins to contact the second substrate.
7. The carrier of claim 2 , wherein the non-conductive frame comprises a first seal in an area where the first substrate contacts the first frame piece and a second seal in an area where the second substrate contacts the second frame piece, the first seal and the second seal to prevent exposure of an interior of the non-conductive frame.
8. The carrier of claim 1 , further comprising:
a plurality of clamps to secure the first frame piece and the second frame piece together.
9. The carrier of claim 1 , wherein the wet chemical processing comprises one of electrochemical deposition, plating pattern resist strip, or etching of a seed metal layer.
10. The carrier of claim 1 , wherein the processing equipment comprises in-line plating equipment.
11. The carrier of claim 1 , wherein the processing equipment comprises batch, rack or flight bar style plating equipment.
12. A method comprising:
holding a first substrate in a carrier, the carrier comprising a first non-conductive frame piece coupled to a second non-conductive frame piece, wherein the first frame piece and second frame piece are substantially identical, and wherein the first substrate is held between the first non-conductive frame piece and the second non-conductive frame piece with a front side of the first substrate exposed through the first non-conductive frame piece; and
coupling the carrier to wet chemical processing equipment.
13. The method of claim 12 , further comprising:
holding a second substrate in the carrier, wherein the second substrate is held between the first non-conductive frame piece and the second non-conductive frame piece with a front side of the second substrate exposed through the second non-conductive frame piece.
14. The method of claim 13 , wherein the carrier further comprises:
a conductive flange;
a first electrical contact coupled to the conductive flange and embedded within the first non-conductive frame piece; and
a second electrical contact coupled to the conductive flange and embedded within the second non-conductive frame piece.
15. The method of claim 14 , wherein coupling the carrier to the processing equipment comprises coupling the conductive flange to the processing equipment.
16. The method of claim 15 , further comprising:
applying an electrical potential to the first substrate and the second substrate through the first electrical contact and the second electrical contact.
17. The method of claim 16 , further comprising:
preventing exposure of an interior of the first non-conductive frame piece and an interior of the second non-conductive frame piece.
18. A system comprising:
wet chemical processing equipment;
means for performing wet chemical processing on a first substrate using the wet chemical processing equipment, the means for performing comprising a carrier comprising a first non-conductive frame piece coupled to a second non-conductive frame piece, wherein the first frame piece and second frame piece are substantially identical.
19. The system of claim 18 , wherein the means for performing comprises:
means for holding the first substrate and a second substrate between the first non-conductive frame piece and the second non-conductive frame piece;
means for attaching the carrier to the processing equipment; and
means for applying an electrical potential to the first and second substrates.