Patent Assignment
Reel/Frame 055517/0021
Assignment of Assignor's Interest
Recorded: 2021-03-08
Pages: 7
Assignors
WU, CHENG-TA
Executed: 2021-03-08
TZENG, KUO-HWA
Executed: 2020-12-04
TU, YEUR-LUEN
Executed: 2020-07-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Back-Side Deep Trench Isolation Structure for Image Sensor